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Sung Kwon Kang

This inventor holds 59 USPTO granted patents and 4 published patent applications, primarily in Microelectronic Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Ultratech, Inc.. Active years: 1991-2018.

USPTO Granted Patents = 59 (Patent Applications = 4)

% Patents Active = 69.5

Average Co-Inventor Count = 4.9

ph-index = 18

Forward Citations = 1,159(Granted Patents)

Forward Citations (Not Self Cited) = 1,135(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Millwood, NY (US) (1992)
Chappagua, NY (US) (1998)
Armonk, NY (US) (2015)
Yorktown Heights, NY (US) (2012 - 2017)
Chappaqua, NY (US) (1991 - 2018)

Company Filing History:

56 out of 166,209

International Business Machines Corporation

Years Active: 1991-2018

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Areas of Expertise:

Microelectronic Packaging

Lead-Free Solder

Substrate Filling

Flip-Chip Interconnections

Electromigration Resistance

Intermetallic Alloy Control

Conductive Adhesives

High Aspect Ratio Vias

Solder Composition

Electrical Conductivity

Thermal Management

Circuit Formation

59 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9872394 - Substrate via filling (2018-01-16),

2. 9565759 - Axiocentric scrubbing land grid array contacts and methods for fabrication (2017-02-07),

3. 9433101 - Substrate via filling (2016-08-30),

4. 9379007 - Electromigration-resistant lead-free solder interconnect structures (2016-06-28),

5. 9082762 - Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip (2015-07-14),

6. 9040841 - Axiocentric scrubbing land grid array contacts and methods for fabrication (2015-05-26),

7. 8691685 - Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present (2014-04-08),

8. 8679964 - Prevention and control of intermetallic alloy inclusions (2014-03-25),

9. 8314500 - Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers (2012-11-20),

10. 8263879 - Axiocentric scrubbing land grid array contacts and methods for fabrication (2012-09-11),

11. 8157158 - Modification of solder alloy compositions to suppress interfacial void formation in solder joints (2012-04-17),

12. 8026613 - Interconnections for flip-chip using lead-free solders and having reaction barrier layers (2011-09-27),

13. 7932169 - Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers (2011-04-26),

14. 7923849 - Interconnections for flip-chip using lead-free solders and having reaction barrier layers (2011-04-12),

15. 7820488 - Microelectronic devices and methods (2010-10-26),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can provide you with an article on inventor Sung Kwon Kang.

Title: Sung Kwon Kang - Pioneering Innovator in Microelectronics

Introduction:

Sung Kwon Kang, a prolific inventor based in Chappaqua, NY, is renowned for his groundbreaking work in the field of microelectronics. With an impressive portfolio of 59 patents, Kang has made significant contributions to the industry through his innovative technologies and methods.

Latest Patents:

Among Sung Kwon Kang's latest patents is the "Substrate via filling" method, which revolutionizes the process of filling vias with metal in substrates. This novel technique involves forming a metal plating layer over the vias on a substrate, fill-plating the vias with a first metal, and meticulously advancing to provide completely filled vias.

Additionally, Kang's patent on "Axiocentric scrubbing land grid array contacts and methods for fabrication" showcases his expertise in designing intricate contact structures for microelectronics devices. This innovation features helically shaped electrically conductive contacts and insulating substrates, highlighting Kang's ingenuity in the field.

Career Highlights:

Sung Kwon Kang has an illustrious career, having worked with esteemed companies such as IBM and Globalfoundries Inc. His tenure at these industry giants has allowed him to develop cutting-edge technologies and enhance the field of microelectronics with his inventive solutions.

Collaborations:

During his career, Sung Kwon Kang has collaborated with notable professionals in the industry, including coworkers Sampath Purushothaman and Da-Yuan Shih. Together, they have pushed the boundaries of innovation and spearheaded advancements in microelectronics technology.

Conclusion:

In conclusion, Sung Kwon Kang stands as a pioneering innovator in the realm of microelectronics, with a remarkable track record of patents and contributions to the industry. His inventive spirit and dedication to pushing the boundaries of technology have solidified his reputation as a trailblazer in the field.

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