The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Apr. 30, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Gareth Hougham, Yorktown Heights, NY (US);

Gerard McVicker, Yorktown Heights, NY (US);

Xiaoxiong Gu, Yorktown Heights, NY (US);

Sung K. Kang, Yorktown Heights, NY (US);

Frank R. Libsch, Yorktown Heights, NY (US);

Xiao H. Liu, Yorktown Heights, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 43/16 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H05K 3/40 (2006.01); H01R 13/24 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01R 12/7082 (2013.01); H01R 12/714 (2013.01); H01R 43/16 (2013.01); H05K 3/4092 (2013.01); H01R 13/2414 (2013.01); H01R 13/2421 (2013.01); H05K 3/326 (2013.01); H05K 2201/0311 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10378 (2013.01); Y10T 29/49224 (2015.01); Y10T 29/49226 (2015.01);
Abstract

A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.


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