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For the Inventor, By the Inventor

Briarcliff Manor, NY, United States of America

Xiao Hu Liu

This inventor holds 90 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Flexible Electronics (CPC class H01L23-5226). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Samsung Electronics Co., Ltd.. Active years: 2005-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiao Hu Liu. Retrieved from https://idiyas.com/inventor/xiao-hu-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 90 

% Patents Active = 44.4

 

Average Co-Inventor Count = 4.8

ph-index = 14

Forward Citations = 729(Granted Patents)

Forward Citations (Not Self Cited) = 657(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Croton-on-Hudson, NY (US) (2005 - 2012)
  • Sunnyvale, CA (US) (2018)
  • Briarcliff, NY (US) (2018)
  • Yorktown Heights, NY (US) (2012 - 2020)
  • Brarcliff Manor, NY (US) (2020)
  • Briarcliff Manor, NY (US) (2008 - 2022)
  • Menlo Park, CA (US) (2022)

Company Filing History:

goldMedal81 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal6 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal2 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
4. 1 out of 962 
 
Chartered Semiconductor Manufacturing Ltd (Corporation)
 patents
5. 1 out of 52 
 
Elpis Technologies Inc.
 patents
6. 1 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2005-2022

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Areas of Expertise:
Flexible Electronics
Wearable Healthcare Sensors
Piezoelectronic Device
Advanced Crack Stop Structure
Thru-Silicon-Via
Nanofluidic Channel
Wafer-Scale Power Delivery
Driving Behavior Models
Dislocation Engineering
Thermal Expansion Control
High Density Chip Interconnect
Fragmentation Control
90 patents (USPTO):Explore Patents
1. 11400944 - Detecting and diagnosing anomalous driving behavior using driving behavior models (2022-08-02),
2. 11295982 - Forming ultra-thin chips for flexible electronics applications (2022-04-05),
3. 11227796 - Enhancement of iso-via reliability (2022-01-18),
4. 11133259 - Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network (2021-09-28),
5. 11015913 - Flexible electronics for wearable healthcare sensors (2021-05-25),
6. 10964881 - Piezoelectronic device with novel force amplification (2021-03-30),
7. 10957657 - Advanced crack stop structure (2021-03-23),
8. 10847475 - Advanced crack stop structure (2020-11-24),
9. 10840195 - Advanced crack stop structure (2020-11-17),
10. 10840194 - Advanced crack stop structure (2020-11-17),
11. 10622220 - Nanofluidic channel fabrication by controlled spontaneous fracturing (2020-04-14),
12. 10546809 - Wafer-scale power delivery (2020-01-28),
13. 10490513 - Advanced crack stop structure (2019-11-26),
14. 10475753 - Advanced crack stop structure (2019-11-12),
15. 10460985 - Enhancement of iso-via reliability (2019-10-29),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I can help you with that. Let's start crafting the article about inventor Xiao Hu Liu.

Title: The Inventive Mind of Xiao Hu Liu: Pioneering Innovations in Semiconductor Technology

Introduction:

Xiao Hu Liu, based in Briarcliff Manor, NY, is a prolific inventor with an impressive track record of 89 patents to his name. He is renowned for his groundbreaking work in the field of semiconductor technology, particularly in the realm of ultra-thin chips for flexible electronics applications and the enhancement of iso-via reliability.

Latest Patents:

Liu's latest patents showcase his ingenuity and technical prowess. One of his recent inventions involves a novel method for forming ultra-thin chips, revolutionizing the fabrication process to enable the creation of advanced flexible electronics. Another patent focuses on enhancing the reliability of iso-vias in semiconductor structures, ensuring optimal performance and longevity.

Career Highlights:

Throughout his career, Xiao Hu Liu has made significant contributions to industry giants like IBM and Globalfoundries Inc. His expertise and innovative spirit have propelled him to the forefront of semiconductor research and development, earning him recognition as a key player in the field.

Collaborations:

Liu has collaborated with esteemed professionals in the industry, including Thomas M Shaw and Gareth Geoffrey Hougham. Together, they have leveraged their collective knowledge and expertise to push the boundaries of semiconductor technology and drive forward the pace of innovation.

Conclusion:

In conclusion, Xiao Hu Liu stands as a testament to the power of creativity and perseverance in the realm of inventions and innovations. His relentless pursuit of excellence and his groundbreaking contributions have cemented his legacy as a trailblazer in the field of semiconductor technology, inspiring future generations of inventors and researchers to push the boundaries of what is possible.

If you need more information or details, feel free to ask!

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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