The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Jun. 11, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Katsuyuki Sakuma, Fishkill, NY (US);

Huan Hu, Yorktown Heights, NY (US);

Xiao Hu Liu, Briarcliff Manor, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 21/3065 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 21/3065 (2013.01); H01L 21/561 (2013.01); H01L 21/6836 (2013.01); H01L 23/3157 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method of fabricating ultra-thin chips is provided. The method includes patterning circuit elements onto a substrate such that sections of the substrate are exposed and etching trenches into the sections of the substrate to define pedestals respectively associated with a corresponding circuit element. The method further includes depositing stressor layer material onto the circuit elements and applying handling tape to the stressor layer material. In addition, the method includes at least one of weakening the substrate in a plane defined by base corners of the pedestals and initiating substrate cracking at the base corners of the pedestals to encourage spalling of the pedestals off the substrate.


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