The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 10, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Xiao Hu Liu, Yorktown Heights, NY (US);

Huan Hu, Haining, CN;

Jianshi Tang, Elmsford, NY (US);

Ning Li, White Plains, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/3105 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3105 (2013.01); H01L 21/02118 (2013.01); H01L 21/32051 (2013.01);
Abstract

A combined nanofluidic and integrated circuit device includes a semiconductor wafer, which includes a substrate with active circuitry formed in the substrate; an oxide layer deposited adjacent the active circuitry; a stressor film deposited onto or into the oxide layer in sections, wherein the stressor film has a higher coefficient of thermal expansion than the oxide layer has; and a nanochannel formed in the oxide layer between the sections of the stressor film. According to an exemplary embodiment, the nanochannel is formed in the oxide layer by cooling the oxide layer and the stressor film to a fracture propagation temperature that is less than first and second temperatures at which the oxide layer and the stressor film are deposited on the substrate.


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