The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 2021

Filed:

Apr. 22, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Huan Hu, Yorktown Heights, NY (US);

Ning Li, White Plains, NY (US);

Xiao Hu Liu, Briarcliff Manor, NY (US);

Katsuyuki Sakuma, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81C 1/00 (2006.01); G01B 7/16 (2006.01); G01L 1/22 (2006.01);
U.S. Cl.
CPC ...
G01B 7/20 (2013.01); B81B 3/0097 (2013.01); B81C 1/0038 (2013.01); B81B 2201/0214 (2013.01); B81B 2207/07 (2013.01); B81C 2201/0194 (2013.01); G01L 1/2293 (2013.01);
Abstract

Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an insulating layer on a silicon substrate. Aspects also include patterning a metal on a silicon substrate. Aspects also include selectively masking the structure to expose the metal and a portion of the silicon substrate. Aspects also include depositing a conductive layer including a conductive metal on the structure. Aspects also include plating the conductive material on the structure. Aspects also include spalling the structure.


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