The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2010
Filed:
Oct. 31, 2007
Sri M. Sri-jayantha, Ossining, NY (US);
Gareth Hougham, Ossining, NY (US);
Sung Kang, Chappaqua, NY (US);
Lawrence Mok, Brewster, NY (US);
Hien Dang, Nanuet, NY (US);
Arun Sharma, New Rochelle, NY (US);
Sri M. Sri-Jayantha, Ossining, NY (US);
Gareth Hougham, Ossining, NY (US);
Sung Kang, Chappaqua, NY (US);
Lawrence Mok, Brewster, NY (US);
Hien Dang, Nanuet, NY (US);
Arun Sharma, New Rochelle, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A microelectronic device is made of a semiconductor substrate, a heat generating component in a layer thereof, and a body within the remaining semiconductor substrate. The body is made of materials which have a high thermal inertia and/or thermal conductivity. When high thermal conductivity materials are used, the body acts to transfer the heat away from the substrate to a heat sink.