Glenn Graham Daves

Title: Glenn Graham Daves: A Pioneer in Semiconductor Device Packaging

Introduction:

Glenn Graham Daves, a resident of Fishkill, NY, is a renowned inventor and innovator in the field of semiconductor device packaging. With an impressive collection of 27 patents and a career spanning prestigious companies like IBM and Freescale Semiconductor, Daves has made significant contributions to the industry. This article explores his latest patents, career highlights, and collaborations, showcasing his expertise in the ever-evolving world of semiconductor technology.

Latest Patents:

One of Daves's recent patents showcases his ingenious method and apparatus for assembling a semiconductor package. This method involves attaching a semiconductor die to a carrier, forming stud bumps and electrically connecting the die to these bumps using bond wires. The semiconductor die, along with the wires and bumps, is then molded in an encapsulation material, and the carrier is subsequently removed. Finally, solder balls are attached to the exposed stud bumps. This novel approach streamlines the packaging process of semiconductor devices, enhancing efficiency and reliability.

Another notable patent by Daves focuses on semiconductor device packaging with pre-encapsulation through via formation using drop-in signal conduits. This invention involves embedding pre-placed through vias in an encapsulated semiconductor package. The signal conduits, which provide signal-bearing pathways between different interconnects or contacts, are placed in a holder before being integrated into the package. This innovation offers flexibility in interconnect configuration and caters to the demands of complex applications, such as system-in-a-package setups.

Career Highlights:

Glenn Graham Daves has accumulated a wealth of experience through his career at renowned technology companies. His work experience includes employment at IBM and Freescale Semiconductor, formerly known as Motorola Semiconductor. These organizations have played a pivotal role in the advancement of semiconductor technology. By contributing to the research and development efforts at such prestigious companies, Daves has undoubtedly left an indelible mark on the industry.

Collaborations:

Throughout his career, Glenn Graham Daves has collaborated with esteemed professionals in the field. Notably, he has worked alongside individuals such as David L Edwards and Frank Louis Pompeo. These collaborations have served as catalysts for innovation, fostering a collaborative environment that facilitates the exchange of ideas and drives progress in semiconductor device packaging.

Conclusion:

Glenn Graham Daves has established himself as an influential figure in the field of semiconductor device packaging. With an impressive array of patents and a career marked by substantial contributions, Daves continues to shape the future of the semiconductor industry. His innovative methodologies, as evidenced by his latest patents, exemplify his commitment to advancing packaging techniques for semiconductor devices. Through collaborations and his tenure at esteemed organizations like IBM and Freescale Semiconductor, Daves has solidified his status as a pioneer and an invaluable asset to the field of semiconductor technology.