The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Aug. 31, 2011
Zhiwei Gong, Chandler, AZ (US);
Navjot Chhabra, Austin, TX (US);
Glenn G. Daves, Austin, TX (US);
Scott M. Hayes, Chandler, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
Jason R. Wright, Chandler, AZ (US);
Zhiwei Gong, Chandler, AZ (US);
Navjot Chhabra, Austin, TX (US);
Glenn G. Daves, Austin, TX (US);
Scott M. Hayes, Chandler, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
Jason R. Wright, Chandler, AZ (US);
Other;
Abstract
A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are placed in a holder that is subsequently embedded in an encapsulated semiconductor device package. The ends of the signal conduits are exposed and the signal conduits are then used as through package vias, providing signal-bearing pathways between interconnects or contacts on the bottom and top of the package. Holders can be provided in a variety of geometries and materials, depending upon the nature of the application. Further, multiple holders with signal conduits can be provided in a single package to provide for more complex interconnect configuration demands in, for example, system-in-a-package applications.