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Douglas G Mitchell

This inventor holds 27 USPTO granted patents and 3 published patent applications. Top assignees: Freescale Semiconductor,inc., Motorola Corporation, Freescale Semiconductors Inc.. Active years: 1989-2016.

USPTO Granted Patents = 27 (Patent Applications = 3)

% Patents Active = 88.9

Average Co-Inventor Count = 3.3

ph-index = 11

Forward Citations = 612(Granted Patents)

Location History:

Irvine, CA (US) (1992)
Tempe, AZ (US) (1989 - 2016)

Company Filing History:

14 out of 5,491

Freescale Semiconductor,inc.

Freescale Semiconductors Inc.

patents

4. 1 out of 834,307

Other

patents

where one patent can have more than one assignee

Years Active: 1989-2016

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27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9520323 - Microelectronic packages having trench vias and methods for the manufacture thereof (2016-12-13),

2. 9502363 - Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers (2016-11-22),

3. 9281293 - Microelectronic packages having layered interconnect structures and methods for the manufacture thereof (2016-03-08),

4. 9142502 - Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits (2015-09-22),

5. 9123685 - Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof (2015-09-01),

6. 9018045 - Microelectronic packages and methods for the fabrication thereof (2015-04-28),

7. 8685790 - Semiconductor device package having backside contact and method for manufacturing (2014-04-01),

8. 8283207 - Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods (2012-10-09),

9. 8216918 - Method of forming a packaged semiconductor device (2012-07-10),

10. 8158492 - MEMS microphone with cavity and method therefor (2012-04-17),

11. 7981730 - Integrated conformal shielding method and process using redistributed chip packaging (2011-07-19),

12. 7950144 - Method for controlling warpage in redistributed chip packaging panels (2011-05-31),

13. 7935571 - Through substrate vias for back-side interconnections on very thin semiconductor wafers (2011-05-03),

14. 7425464 - Semiconductor device packaging (2008-09-16),

15. 6878633 - Flip-chip structure and method for high quality inductors and transformers (2005-04-12),

Title: Inventor Douglas G Mitchell: Pioneering Innovations in Tempe

Introduction: Douglas G Mitchell is a renowned inventor based in Tempe, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Douglas G Mitchell holds several patents in the fields of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Douglas G Mitchell has consistently pushed the boundaries of innovation, leading to significant advancements in his respective fields.

Collaborations: Throughout his career, Douglas G Mitchell has collaborated with leading companies, research institutions, and universities to bring his inventions to life and make a lasting impact on society.

Conclusion: Inventor Douglas G Mitchell's passion for innovation and dedication to creating a better future through his inventions have solidified his reputation as a visionary in the world of technology and beyond.

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