The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2008
Filed:
Mar. 10, 2006
Owen R. Fay, Gilbert, AZ (US);
Kevin R. Lish, Gilbert, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
Owen R. Fay, Gilbert, AZ (US);
Kevin R. Lish, Gilbert, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Methods and apparatus are provided for encapsulating electronic devices, comprising: providing one or more electronic devices () with primary faces () having electrical contacts (), opposed rear faces () and edges () therebetween. A sacrificial layer () is provided on the primary faces (). The devices () are mounted on a temporary support () so that the sacrificial layer () faces toward the temporary support (). A plastic encapsulation ()is formed in contact with at least the lateral edges () of the electronic devices (). The plastic encapsulation () is at least partially cured and the devices () and plastic encapsulation () separated from the temporary support (), thereby exposing the sacrificial layer (). The sacrificial layer () is removed. The devices () and edge-contacting encapsulation are mounted on a carrier () with the primary faces () and electrical contacts () exposed and, optionally, further cured. Insulators () and conductors () applied to the primary faces couple electrical contacts () on various devices () to each other and to external contacts, thereby forming an integrated multi-device panel ().