The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2015
Filed:
Jul. 15, 2013
Weng Foong Yap, Phoenix, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
Weng Foong Yap, Phoenix, AZ (US);
Douglas G. Mitchell, Tempe, AZ (US);
FREESCALE SEMICONDUCTOR INC., Austin, TX (US);
Abstract
Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes forming one or more redistribution layers over an encapsulated die having a frontside bond pad area and a frontside passivated non-bond pad area. The redistribution layers are formed to have a frontside opening over the non-bond pad area of the encapsulated die. A primary heat sink body is provided in the frontside opening and thermally coupled to the encapsulated die. A contact array is formed over the redistribution layers and is electrically coupled to a plurality bond pads located on the frontside bond pad area of the encapsulated die.