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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Weng Foong Yap

This inventor holds 39 USPTO granted patents and 3 published patent applications, primarily in Microelectronic Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc., Nsp USA, Inc.. Active years: 2014-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Weng Foong Yap. Retrieved from https://idiyas.com/inventor/weng-foong-yap

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 39 

% Patents Active = 97.4

Average Co-Inventor Count = 1.8

ph-index = 10

Forward Citations = 280(Granted Patents)


Location History:

  • Shah Alam, MY (2015)
  • Phoenix, AZ (US) (2014 - 2018)
  • Chandler, AZ (US) (2015 - 2022)

Company Filing History:

goldMedal28 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal10 out of 2,846 
 
Nxp USA, Inc.
 patents
bronzeMedal1 out of 4 
 
Nsp USA, Inc.
 patents

Years Active: 2014-2022

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Areas of Expertise:
Wafer Level Packaging
Microelectronic Packages
Semiconductor Device
Thermal Management
Stacked Assemblies
Radio Frequency
Signal Routing
Interconnect Structures
Surface Mount Devices
Fabrication Methods
Pressure Sensor
Embedded Ground Plane
39 patents (USPTO):Explore Patents
1. 11427464 - Packaged pressure sensor device (2022-08-30),
2. 10822224 - Packaged pressure sensor device (2020-11-03),
3. 10319689 - Antenna assembly for wafer level packaging (2019-06-11),
4. 9997492 - Optically-masked microelectronic packages and methods for the fabrication thereof (2018-06-12),
5. 9786515 - Semiconductor device package and methods of manufacture thereof (2017-10-10),
6. 9780077 - System-in-packages containing preassembled surface mount device modules and methods for the production thereof (2017-10-03),
7. 9761569 - Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof (2017-09-12),
8. 9698104 - Integrated electronic package and stacked assembly thereof (2017-07-04),
9. 9607918 - Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof (2017-03-28),
10. 9595509 - Stacked microelectronic package assemblies and methods for the fabrication thereof (2017-03-14),
11. 9589909 - Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers (2017-03-07),
12. 9524950 - Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof (2016-12-20),
13. 9502363 - Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers (2016-11-22),
14. 9472528 - Integrated electronic package and method of fabrication (2016-10-18),
15. 9401339 - Wafer level packages having non-wettable solder collars and methods for the fabrication thereof (2016-07-26),

Title: Weng Foong Yap: Innovator in Pressure Sensor Technology

Introduction

Weng Foong Yap is a distinguished inventor based in Chandler, AZ, known for his significant contributions to the field of pressure sensor technology. With an impressive portfolio of 39 patents, Yap has demonstrated his expertise and innovative spirit throughout his career.

Latest Patents

One of Weng Foong Yap's latest patents includes a "Packaged Pressure Sensor Device." This invention features a sophisticated design that consists of a pressure sensor die with a diaphragm, which is encapsulated by a specialized material. The structure includes an interconnect layer aligned with the pressure sensor die’s diaphragm, alongside a cap that possesses a vent hole for optimal functionality. This advancement showcases Yap's commitment to enhancing the efficiency and reliability of electronic devices.

Career Highlights

Yap has contributed to notable companies, including Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these leading technology firms has enriched his knowledge and skills, allowing him to innovate and improve existing technologies. His work in pressure sensors has positioned him as a respected figure in the electronics field.

Collaborations

Throughout his career, Weng Foong Yap has had the opportunity to collaborate with accomplished professionals such as Michael B. Vincent and Zhiwei Gong. These interactions have fostered a productive exchange of ideas and advancements in technology, further enhancing the field of pressure sensors.

Conclusion

Weng Foong Yap's remarkable contributions to pressure sensor technology mark him as an influential inventor. His extensive portfolio, defined by innovative solutions like the packaged pressure sensor device, continues to inspire advancements within the industry. As technology evolves, Yap's work will likely play a pivotal role in shaping the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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