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Weng Foong Yap

USPTO Granted Patents = 39 (Patent Applications = 3)

Average Co-Inventor Count = 1.8

ph-index = 9

Forward Citations = 274(Granted Patents)

Location History:

Shah Alam, MY (2015)
Phoenix, AZ (US) (2014 - 2018)
Chandler, AZ (US) (2015 - 2022)

Company Filing History:

28 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2014-2022

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39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11427464 - Packaged pressure sensor device (2022-08-30),

2. 10822224 - Packaged pressure sensor device (2020-11-03),

3. 10319689 - Antenna assembly for wafer level packaging (2019-06-11),

4. 9997492 - Optically-masked microelectronic packages and methods for the fabrication thereof (2018-06-12),

5. 9786515 - Semiconductor device package and methods of manufacture thereof (2017-10-10),

6. 9780077 - System-in-packages containing preassembled surface mount device modules and methods for the production thereof (2017-10-03),

7. 9761569 - Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof (2017-09-12),

8. 9698104 - Integrated electronic package and stacked assembly thereof (2017-07-04),

9. 9607918 - Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof (2017-03-28),

10. 9595509 - Stacked microelectronic package assemblies and methods for the fabrication thereof (2017-03-14),

11. 9589909 - Radio frequency and electromagnetic interference shielding in wafer level packaging using redistribution layers (2017-03-07),

12. 9524950 - Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof (2016-12-20),

13. 9502363 - Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers (2016-11-22),

14. 9472528 - Integrated electronic package and method of fabrication (2016-10-18),

15. 9401339 - Wafer level packages having non-wettable solder collars and methods for the fabrication thereof (2016-07-26),

Title: Weng Foong Yap: Innovator in Pressure Sensor Technology

Introduction

Weng Foong Yap is a distinguished inventor based in Chandler, AZ, known for his significant contributions to the field of pressure sensor technology. With an impressive portfolio of 39 patents, Yap has demonstrated his expertise and innovative spirit throughout his career.

Latest Patents

One of Weng Foong Yap's latest patents includes a "Packaged Pressure Sensor Device." This invention features a sophisticated design that consists of a pressure sensor die with a diaphragm, which is encapsulated by a specialized material. The structure includes an interconnect layer aligned with the pressure sensor die’s diaphragm, alongside a cap that possesses a vent hole for optimal functionality. This advancement showcases Yap's commitment to enhancing the efficiency and reliability of electronic devices.

Career Highlights

Yap has contributed to notable companies, including Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these leading technology firms has enriched his knowledge and skills, allowing him to innovate and improve existing technologies. His work in pressure sensors has positioned him as a respected figure in the electronics field.

Collaborations

Throughout his career, Weng Foong Yap has had the opportunity to collaborate with accomplished professionals such as Michael B. Vincent and Zhiwei Gong. These interactions have fostered a productive exchange of ideas and advancements in technology, further enhancing the field of pressure sensors.

Conclusion

Weng Foong Yap's remarkable contributions to pressure sensor technology mark him as an influential inventor. His extensive portfolio, defined by innovative solutions like the packaged pressure sensor device, continues to inspire advancements within the industry. As technology evolves, Yap's work will likely play a pivotal role in shaping the future of electronic devices.

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