The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jun. 05, 2014
Freescale Semiconductor, Inc., Austin, TX (US);
Weng F. Yap, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An integrated electronic package includes an integrated circuit (IC) die and conductive discrete components. Electrical interconnects are formed directly between bond pads on an active side of the IC die and contacts on the conductive discrete components without an intervening lead frame. The IC die, conductive discrete components and electrical interconnects are embedded in an encapsulation material. Contact surfaces of at least some of the conductive discrete components are exposed from the encapsulation material and can be attached to a printed circuit board in order to mount the integrated electronic package to the printed circuit board.