The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Sep. 08, 2015
Freescale Semiconductor Inc., Austin, TX (US);
Weng F. Yap, Chandler, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
Stacked microelectronic package assemblies are provided, as are methods for producing stacked microelectronic package assemblies. In one embodiment, the stacked microelectronic package assembly includes a base package layer onto which a stacked bridge device is stacked. The base package layer includes, in turn, a first microelectronic package and a second microelectronic package positioned laterally adjacent the first microelectronic package. The stacked bridge device extends over the first and second microelectronic packages. A first terminal of the stacked bridge device is soldered to or otherwise electrically joined to a first backside contact of the first microelectronic package, and a second terminal of the stacked bridge device is soldered to or otherwise electrically joined to a second backside contact of the second microelectronic package.