The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Oct. 23, 2015
Freescale Semiconductor, Inc., Austin, TX (US);
Weng F. Yap, Chandler, AZ (US);
Eduard J. Pabst, Mesa, AZ (US);
NXP USA, INC., Austin, TX (US);
Abstract
Radio frequency/electromagnetic interference (RF/EMI) shielding within redistribution layers of a fan-out wafer level package is provided. By using RDL metal layers to provide the shielding, additional process steps are avoided (e.g., incorporating a shielding lid or applying conformal paint on the package back side). Embodiments use metal filled trench vias in the RDL dielectric layers to provide metal 'walls' around the RF sensitive signal lines through the dielectric layer regions of the RDL. These walls are coupled to ground, which isolates the signal lines from interference or noise generated outside the walls.