Poughkeepsie, NY, United States of America

Steven Paul Ostrander

This inventor holds 46 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Alfred University, Globalfoundries Inc.. Active years: 1995-2026.

USPTO Granted Patents = 46 

% Patents Active = 65.2

Average Co-Inventor Count = 5.1

ph-index = 10

Forward Citations = 281(Granted Patents)


Location History:

  • Scotai, NY (US) (1998)
  • Scotia, NY (US) (1995 - 2001)
  • Wappingers Falls, NY (US) (2003 - 2004)
  • Yorktown Heights, NY (US) (2012)
  • Hopewell Junction, NY (US) (2014)
  • Poughkeepsie, NY (US) (2004 - 2024)

Company Filing History:


Years Active: 1995-2026

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Areas of Expertise:
Multichip Modules
Thermal Management
Crack Prevention
Optoelectronic Devices
Electrical Interconnections
Thermal Interface Materials
High Thermal Conductivity
Stacked Via Rivets
Adhesion Techniques
Integrated Circuit Assembly
Optical Assemblies
46 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Steven Paul Ostrander

Introduction: Steven Paul Ostrander, based in Poughkeepsie, NY, is an accomplished inventor with an impressive portfolio of 42 patents. His work primarily focuses on advancements in hardware security and structural integrity in electronic components. Ostrander's innovative spirit has significantly influenced the fields he has engaged in, showcasing a deep understanding of both technology and engineering principles.

Latest Patents: Among his most recent patents is the development of a Multi Chip Hardware Security Module. This innovative module features a laminate carrier-like lid that incorporates multiple layers of non-conductive materials. The design includes sensor circuitry that creates a continuous electrical circuit around the electronic components, enhancing both functionality and security. Additionally, thermal circuitry with solid copper traces is embedded to efficiently conduct heat from the module's components. Another significant patent involves a structure with stacked rivets addressing stress hotspots. This design utilizes a rivet cell that extends through dielectric regions, effectively managing the energy release rate and reinforcing the structure's integrity.

Career Highlights: Steven's career has been marked by influential roles at prominent organizations. He has contributed significantly at IBM, one of the leading technology companies, and at Alfred University, where he likely participated in research and development initiatives. His expertise has proven invaluable in advancing technological solutions within these institutions.

Collaborations: Throughout his career, Steven has worked alongside notable colleagues such as Michael A. Gaynes and Gregory C. Stangle. These collaborations have fostered a productive environment for innovation, enabling the development of technologies that leverage their combined knowledge and skills.

Conclusion: Steven Paul Ostrander exemplifies the impact of dedicated inventors in the technology landscape. Through his 42 patents, he has made substantial contributions that enhance hardware security and structural efficiency in electronic designs. His work continues to inspire future innovations, demonstrating the importance of inventive thinking in addressing complex technical challenges.

Profile summary based on public USPTO records.
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