The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

Dec. 18, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Savannah, GA (US);

Jon A. Casey, Poughkeepsie, NY (US);

Brian M. Erwin, Lagrangeville, NY (US);

Steven P. Ostrander, Poughkeepsie, NY (US);

Brian W. Quinlan, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 25/16 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01);
Abstract

A laminate includes a buildup layer having a top and a bottom and a solder mask contacting the top. The laminate also includes a circuit element disposed on the top of the buildup layer and at least partially covered by the solder mask, the circuit element including a first via formed therein that allows for a power signal provided to an underside of the circuit element to be provided to a first connection on a top of the circuit element.


Find Patent Forward Citations

Loading…