The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2024

Filed:

Oct. 22, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Sushumna Iruvanti, Wappingers Falls, NY (US);

James Busby, New Paltz, NY (US);

Philipp K Buchling Rego, Wappingers Falls, NY (US);

Steven Paul Ostrander, Poughkeepsie, NY (US);

Thomas Anthony Wassick, LaGrangeville, NY (US);

William Santiago-Fernandez, Hopewell Junction, NY (US);

Nihad Hadzic, Wappingers Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/00 (2006.01); G06F 21/86 (2013.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); G06F 21/86 (2013.01); H01L 23/57 (2013.01); H05K 1/0275 (2013.01);
Abstract

A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.


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