The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Jan. 31, 2020
International Business Machines Corporation, Armonk, NY (US);
Tuhin Sinha, Oradell, NJ (US);
Krishna R. Tunga, Wappingers Falls, NY (US);
Brian W. Quinlan, Poughkeepsie, NY (US);
Charles Leon Arvin, Poughkeepsie, NY (US);
Steven Paul Ostrander, Poughkeepsie, NY (US);
Thomas Weiss, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.