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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Krishna R Tunga

USPTO Granted Patents = 44 

Average Co-Inventor Count = 3.5

ph-index = 3

Forward Citations = 37(Granted Patents)


Location History:

  • Wappiners Falls, NY (US) (2018)
  • Wappingers Falls, NY (US) (2013 - 2023)

Company Filing History:

goldMedal41 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal2 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal1 out of 51 
 
Elpis Technologies Inc.
 patents

Years Active: 2013-2023

where 'Filed Patents' based on already Granted Patents

44 patents (USPTO):
1. 11784160 - Asymmetric die bonding (2023-10-10),
2. 11756911 - Metal pad modification (2023-09-12),
3. 11744981 - Internet of things (IoT) real-time response to defined symptoms (2023-09-05),
4. 11545444 - Mitigating cooldown peeling stress during chip package assembly (2023-01-03),
5. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),
6. 11302205 - Language learning and speech enhancement through natural language processing (2022-04-12),
7. 11282773 - Enlarged conductive pad structures for enhanced chip bond assembly yield (2022-03-22),
8. 11239183 - Mitigating thermal-mechanical strain and warpage of an organic laminate substrate (2022-02-01),
9. 11210968 - Behavior-based interactive educational sessions (2021-12-28),
10. 11185658 - Internet of things (IOT) real-time response to defined symptoms (2021-11-30),
11. 10985129 - Mitigating cracking within integrated circuit (IC) device carrier (2021-04-20),
12. 10950573 - Lead-free column interconnect (2021-03-16),
13. 10916154 - Language learning and speech enhancement through natural language processing (2021-02-09),
14. 10832987 - Managing thermal warpage of a laminate (2020-11-10),
15. 10777482 - Multipart lid for a semiconductor package with multiple components (2020-09-15),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees and patents, I'll be delighted to assist you with the article about inventor Krishna R Tunga. Here is the structured article based on the given data:

Title: Unveiling the Inventive Journey of Krishna R Tunga

Introduction:

Krishna R Tunga, a talented inventor based in Wappingers Falls, NY (US), has made significant contributions to the field of technology with an impressive portfolio of 44 patents.

Latest Patents:

Krishna's innovative spirit shines through his latest patents, including the groundbreaking 'Asymmetric Die Bonding' and 'Metal Pad Modification' technologies. The former revolutionizes integrated circuit packaging by asymmetrically positioning the die and adjusting connectors, while the latter introduces a unique structure for metal pads, enhancing their alignment on base materials.

Career Highlights:

Throughout his career, Krishna has worked with renowned companies such as IBM (International Business Machines Corporation) and Globalfoundries Inc., where he has honed his skills and expertise in cutting-edge technologies.

Collaborations:

Collaboration is key in the world of innovation, and Krishna has had the privilege of working alongside visionaries like Charles Leon Arvin and Thomas Weiss. These collaborations have led to the development of groundbreaking technologies and cemented Krishna's reputation as a prolific inventor.

Conclusion:

In conclusion, Krishna R Tunga's inventive prowess and commitment to pushing the boundaries of technology have established him as a formidable force in the world of innovation. His impressive patent portfolio and collaborative endeavors serve as a testament to his dedication to driving technological advancements forward.

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