The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Apr. 10, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Krishna R. Tunga, Wappingers Falls, NY (US);

Thomas Weiss, Poughkeepsie, NY (US);

Charles Leon Arvin, Poughkeepsie, NY (US);

Bhupender Singh, Fishkill, NY (US);

Brian W. Quinlan, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/50 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01); H01L 24/14 (2013.01); H01L 2021/60225 (2013.01);
Abstract

An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.


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