International Business Machines Corporation

Alfred University

Globalfoundries Inc.

Jds Uniphase Corporation

Elpis Technologies Inc.

Steven Paul Ostrander

Michael A Gaynes

Walter A Schulze, Jr

Gregory C Stangle

Koththavasal R Venkatachari

Charles Leon Arvin

Thomas Weiss

Jiantao Zheng

Kamal Kumar Sikka

Hilton T Toy

Jeffrey Allen Zitz

Krishna R Tunga

Thomas Edward Lombardi

Brian W Quinlan

Judith Marie Roldan

Evan G Colgan

Jon Alfred Casey

Emanuel Israel Cooper

Carlos Juan Sambucetti

Sudipta Kumar Ray

Ravi F Saraf

Edmund D Blackshear

Kenneth Charles Marston

Tuhin Sinha

Donald Merte

Richard B Booth

Martin Beaumier

Jean Labonte

John Ulrich Knickerbocker

Paul William Coteus

Mark Kenneth Hoffmeyer

Sushumna Iruvanti

Thomas Anthony Wassick

Frank Louis Pompeo

Subhash Laxman Shinde

Sungjun Chun

Jeannine Madelyn Trewhella

Rajneesh Kumar

Paul F Bodenweber

Virendra R Jadhav

Charles L Reynolds

Sylvain E Ouimet

Pascale Gagnon

Dureseti Chidambarrao

Mukta G Farooq

Daniel Mark Dreps

Kirk David Peterson

Christopher David Muzzy

Sri Muthuthamby Sri-Jayantha

Martin L Schmatz

Mark Vincent Pierson

Da-Yuan Shih

Eugen Schenfeld

Prabjit Singh

George Frederick Walker

David L Edwards

James A Busby

Roger Donell Weekly

Sung Kwon Kang

Bruce Kenneth Furman

Mario John Interrante

How Tzu Lin

David S Wolpert

William Santiago-Fernandez

John Lee Colbert

Brian Richard Sundlof

Douglas Oliver Powell

David Peter Gaio

Jean Audet

William K Hogan

Mitchell S Cohen

Anson Jay Call

Lisa Jeanine Jimarez

Brian Michael Erwin

Ronald Pete Luijten

Jeffrey Alan Kash

Glenn Graham Daves

Monty Montague Denneau

Roger Duane Hamilton

Donald W Henderson

Patrick Anthony Coico

Michael S Gray

Nihad Hadzic

William Edward Sablinski

Dinesh Gupta

Jason R Eagle

Atsushi Ogino

Randall G Kemink

Brenda Lee Peterson

Jaynal Abedin Molla

Matthew Thomas Guzowski

Jeffrey Thomas Coffin

William T Devine

Bhupender Singh

Sylvain Pharand

Jiali Wu

Karen P McLaughlin

George J Saxenmeyer, Jr

Sol Krongelb

Philipp K Buchling Rego

Multicomponent module assembly by identifying a failed site on a laminate comprising a plurality of sites, adding a machine discernible mark associated with the failed site, placing an electrically good element at a successful site; and providing an MCM comprising the laminate, and the electrically good element.

Multicomponent module design and fabrication

A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

Multi chip hardware security module

A structure including a plurality of dielectric regions is described. The structure can include a rivet cell. The rivet cell can include a set of stacked vias. The rivet cell can extend through a stress hotspot of the structure. A length of the rivet cell can thread through at least one dielectric region among the plurality of dielectric regions. The rivet cell can be among a number of rivet cells inserted in the stress hotspot. The stress hotspot can be among a plurality of stress hotspots across the structure. A length of the rivet cell can be based on a model of a relationship between the length of the rivet cell and an energy release rate of the structure. The rivet cell can thread through an interface between a first dielectric region and a second dielectric region having different dielectric constants.

Stacked via rivets in chip hotspots

A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

Mitigating thermal-mechanical strain and warpage of an organic laminate substrate

In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.

Connecting a component to a substrate by adhesion to an oxidized solder surface

An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.

Electronic apparatus having inter-chip stiffener

A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

Multipart lid for a semiconductor package with multiple components

A methodology and associated wafer level assembly of testing crackstop structure designs. The wafer level semiconductor assembly includes: a substrate structure shaped to define a set of horizontal directions; a metallization layer located on top of the substrate structure, with the metallization layer including a crackstop structure formed therein in accordance with a crackstop structure design; and a tensioned layer located on top of the metallization layer, with the tensioned layer being made of material having internal tensile forces oriented in the horizontal directions. The tensile forces promote horizontal direction crack propagation in the metallization layer so that the crackstop structure design can be tested more rigorously and reliably before deciding on the crackstop design structure to put into mass production (which mass produced product would typically not include the tensioned layer).

Determining crackstop strength of integrated circuit assembly at the wafer level

A laminate includes a buildup layer having a top and a bottom and a solder mask contacting the top. The laminate also includes a circuit element disposed on the top of the buildup layer and at least partially covered by the solder mask, the circuit element including a first via formed therein that allows for a power signal provided to an underside of the circuit element to be provided to a first connection on a top of the circuit element.

Under die surface mounted electrical elements

A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Method for shaping a laminate substrate

An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

Determining magnitude of compressive loading

Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Precast thermal interface adhesive for easy and repeated, separation and remating

A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.

Laminate peripheral clamping to control microelectronic module BSM warpage

Growing community of inventors

Poughkeepsie, NY, United States of America

Steven Paul Ostrander