This inventor holds 58 USPTO granted patents and 3 published patent applications, primarily in Electrical Interconnects (CPC class 5284). Top assignees: International Business Machines Corporation, Ultratech, Inc., Other. Active years: 1993-2015.
Inventors with similar research interests:
Location History:
- Fishkill, NY (US) (2004)
- Williston, VT (US) (2001 - 2006)
- Beacon, NY (US) (1993 - 2007)
- Poughguang, NY (US) (2008)
- Poughguag, NY (US) (2010)
- Pouquag, NY (US) (2010)
- Saratoga Springs, NY (US) (2010 - 2011)
- Poughquag, NY (US) (2005 - 2013)
- Plattsburgh, NY (US) (2015)
Company Filing History:
55 out of 166,325Â 
2 out of 138Â 
1 out of 834,453Â Years Active: 1993-2015
Areas of Expertise:
Title: The Innovations of Bruce Kenneth Furman: A Look at His Contributions to Substrate Bonding
Introduction
Bruce Kenneth Furman, based in Poughquag, NY, has made significant contributions to the field of substrate bonding through his inventive work. With an impressive portfolio of 58 patents, Furman has demonstrated a commitment to advancing technology, especially in the realm of metal-dielectric patterns. His latest patents showcase innovative structures and methods that enhance the functionality of integrated systems.
Latest Patents
Furman's recent patents focus on the bonding of substrates that contain metal-dielectric patterns. One notable patent involves a method for bonding two substrates, where the first substrate has a metal-dielectric pattern with the metal raised above the dielectric. This innovative approach involves a first substrate having a metal-dielectric pattern, consisting of a metal with a concave upper surface and a dielectric exhibiting a uniform upper surface. In this configuration, the metal is elevated above the dielectric. The second substrate, which is bonded to the first, includes a dielectric and a metal located below its dielectric layer. This unique bonding method results in strong electrical and thermal connections, facilitating the creation of three-dimensional integrated structures with enhanced capabilities. Another related patent describes a similar method and underscores the importance of the raised metal in establishing robust bonding and functionality.
Career Highlights
Throughout his career, Bruce Kenneth Furman has worked with renowned companies, notably IBM and Ultratech, Inc. His experience at these institutions has significantly influenced his development as an inventor, allowing him to innovate within collaborative environments. His work has positioned him at the forefront of technological advancements in substrate bonding.
Collaborations
Furman's collaborations with distinguished colleagues such as Marie Angelopoulos and Sampath Purushothaman have further enriched his inventions. Partnering with other talented professionals in the industry, he has been able to share knowledge and insights, fostering an environment conducive to innovation.
Conclusion
Bruce Kenneth Furman is a notable inventor whose contributions have had a lasting impact on substrate bonding technology. With a substantial number of patents highlighting his inventive methods and structures, he continues to pave the way for advancements in the field. His collaborations and career at prestigious companies underscore his role as a significant figure in the innovation landscape.