The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2015
Filed:
Sep. 17, 2013
International Business Machines Corporation, Armonk, NY (US);
Kuan-Neng Chen, Hsinchu, TW;
Bruce K. Furman, Plattsburgh, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
David L. Rath, Stormville, NY (US);
Anna W. Topol, Wappingers Falls, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric, as well as related structures, are disclosed. One structure includes: a first substrate having a metal-dielectric pattern on a surface thereof, the metal-dielectric pattern including: a metal having a concave upper surface; and a dielectric having a substantially uniform upper surface, wherein the metal on the first substrate is raised above the dielectric on the first substrate; and a second substrate bonded with the first substrate, the second substrate including: a dielectric; and a metal positioned substantially below the dielectric of the second substrate, wherein the first substrate and the second substrate are bonded only at the metal from the first substrate and the metal from the second substrate.