Cornelia K Tsang

Title: Innovator Spotlight: Cornelia K. Tsang

Introduction

Cornelia K. Tsang, based in Mohegan Lake, NY, has made significant contributions to the field of electrical devices, boasting an impressive portfolio of 54 patents. Her innovations, particularly in wafer bonding and interconnect technologies, showcase her expertise and commitment to advancing technology.

Latest Patents

Among Cornelia's latest patents are the "Large Channel Interconnects with Through Silicon Vias (TSVs)" and the "Direct Bond Transfer Layers for Manufacturable Sealing of Microfluidic Chips." The first patent focuses on an electrical device that incorporates at least two active wafers with through silicon vias and a unitary electrical communication and spacer structure. This invention is designed to facilitate better electrical communication and efficient coolant passage between stacked active wafers. The second patent introduces wafer bonding techniques for sealing microfluidic chips, enhancing the manufacturing process and functionality of fluidic chip devices.

Career Highlights

Throughout her career, Cornelia has worked with leading companies in the technology sector, including IBM and Globalfoundries Inc. Her work at these organizations has not only contributed to their advancements in technology but has also highlighted her role as a key innovator in the industry.

Collaborations

Cornelia has collaborated with notable professionals, including Paul Stephen Andry and John Ulrich Knickerbocker. These partnerships have fostered an environment of innovation and have played a critical role in the development of her patented technologies.

Conclusion

Cornelia K. Tsang's achievements and her dedication to her field underscore her position as a leading inventor in electrical device technology. With her numerous patents and collaborative efforts, she continues to pave the way for future innovations in the industry.