Mohegan Lake, NY, United States of America

Cornelia K Tsang

This inventor holds 54 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Johnson and Johnson Vision Care, Inc.. Active years: 2004-2021.

USPTO Granted Patents = 54 

% Patents Active = 63.0

 

Average Co-Inventor Count = 4.7

ph-index = 10

Forward Citations = 373(Granted Patents)

Forward Citations (Not Self Cited) = 362(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Mogegan Lake, NY (US) (2010)
  • Yorktown Heights, NY (US) (2012)
  • Medford, VA (US) (2019)
  • Medford, MA (US) (2017 - 2020)
  • Mohegan Lake, NY (US) (2004 - 2021)

Company Filing History:


Years Active: 2004-2021

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Areas of Expertise:
Through Silicon Vias
Microfluidic Chips
Chip Stack Structures
Two-Phase Cooling
Wafer Bonding
Integrated Circuits
Laser Ablation
Silicon Space Transformers
Energy Sources
Electromagnetic Radiation Blocking
Cushion Polymer Layer
Deep Via Connections
54 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Cornelia K. Tsang

Introduction

Cornelia K. Tsang, based in Mohegan Lake, NY, has made significant contributions to the field of electrical devices, boasting an impressive portfolio of 54 patents. Her innovations, particularly in wafer bonding and interconnect technologies, showcase her expertise and commitment to advancing technology.

Latest Patents

Among Cornelia's latest patents are the "Large Channel Interconnects with Through Silicon Vias (TSVs)" and the "Direct Bond Transfer Layers for Manufacturable Sealing of Microfluidic Chips." The first patent focuses on an electrical device that incorporates at least two active wafers with through silicon vias and a unitary electrical communication and spacer structure. This invention is designed to facilitate better electrical communication and efficient coolant passage between stacked active wafers. The second patent introduces wafer bonding techniques for sealing microfluidic chips, enhancing the manufacturing process and functionality of fluidic chip devices.

Career Highlights

Throughout her career, Cornelia has worked with leading companies in the technology sector, including IBM and Globalfoundries Inc. Her work at these organizations has not only contributed to their advancements in technology but has also highlighted her role as a key innovator in the industry.

Collaborations

Cornelia has collaborated with notable professionals, including Paul Stephen Andry and John Ulrich Knickerbocker. These partnerships have fostered an environment of innovation and have played a critical role in the development of her patented technologies.

Conclusion

Cornelia K. Tsang's achievements and her dedication to her field underscore her position as a leading inventor in electrical device technology. With her numerous patents and collaborative efforts, she continues to pave the way for future innovations in the industry.

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