The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Feb. 21, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Paul S. Andry, Yorktown Heights, NY (US);
Edmund J. Sprogis, Underhill, VT (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/20 (2006.01); H01L 21/683 (2006.01); H01L 21/762 (2006.01); H01L 21/822 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/06 (2013.01); H01L 21/2007 (2013.01); H01L 21/6835 (2013.01); H01L 21/76251 (2013.01); H01L 21/8221 (2013.01); H01L 27/0688 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2924/00011 (2013.01);
Abstract
CMOS structures with a replacement substrate and methods of manufacture are disclosed herein. The method includes forming a device on a temporary substrate. The method further includes removing the temporary substrate. The method further includes bonding a permanent electrically insulative substrate to the device with a bonding structure.