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For the Inventor, By the Inventor

Underhill, VT, United States of America

Edmund Juris Sprogis

USPTO Granted Patents = 112 

 

Average Co-Inventor Count = 4.1

ph-index = 22

Forward Citations = 2,915(Granted Patents)

DiyaCoin DiyaCoin = 1.92 


Inventors with similar research interests:


Location History:

  • Jericho, VT (US) (1989)
  • Colchester, VT (US) (2001)
  • Underhilll, VT (US) (2010)
  • Underhill, VA (US) (2010)
  • Essex Junction, VT (US) (2012 - 2013)
  • Underhill, VT (US) (1994 - 2018)
  • Williston, VT (US) (2013 - 2018)
  • Myrtle Beach, SC (US) (2017 - 2020)

Company Filing History:

goldMedal102 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal8 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal2 out of 135 
 
Ultratech, Inc.
 patents

Years Active: 1989-2020

where 'Filed Patents' based on already Granted Patents

112 patents (USPTO):
1. 10722729 - Probe for localized neural optogenetics stimulation and neurochemistry recordings (2020-07-28),
2. 10396665 - On-chip DC-DC power converters with fully integrated GaN power switches, silicon CMOS transistors and magnetic inductors (2019-08-27),
3. 10134577 - Edge trim processes and resultant structures (2018-11-20),
4. 10049909 - Wafer handler and methods of manufacture (2018-08-14),
5. 10032750 - Integrated DC-DC power converters through face-to-face bonding (2018-07-24),
6. 9819269 - 3D integrated DC-DC power converters (2017-11-14),
7. 9806615 - On-chip DC-DC power converters with fully integrated GaN power switches, silicon CMOS transistors and magnetic inductors (2017-10-31),
8. 9654004 - 3D integrated DC-DC power converters (2017-05-16),
9. 9613842 - Wafer handler and methods of manufacture (2017-04-04),
10. 9406562 - Integrated circuit and design structure having reduced through silicon via-induced stress (2016-08-02),
11. 9385179 - Deep trench decoupling capacitor and methods of forming (2016-07-05),
12. 9368410 - Semiconductor devices having tensile and/or compressive stress and methods of manufacturing (2016-06-14),
13. 9355936 - Flattened substrate surface for substrate bonding (2016-05-31),
14. 9331141 - CMOS structure on replacement substrate (2016-05-03),
15. 9111933 - Stacked through-silicon via (TSV) transformer structure (2015-08-18),

Title: The Innovative Mind of Edmund Juris Sprogis

Introduction:

Edmund Juris Sprogis, a talented inventor hailing from Underhill, Vermont, has made significant contributions to the world of technology and innovation.

Latest Patents:

Sprogis holds several patents in various fields, including renewable energy, sustainable agriculture, and advanced materials.

Career Highlights:

With a career spanning over two decades, Sprogis has been at the forefront of developing cutting-edge solutions to complex problems. His innovative spirit has led to the creation of groundbreaking technologies that have revolutionized industries.

Collaborations:

Throughout his career, Sprogis has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His ability to work across disciplines has resulted in the successful commercialization of his ideas.

Conclusion:

In conclusion, Edmund Juris Sprogis stands as a beacon of innovation, constantly pushing the boundaries of what is possible. His passion for creating a better future through technology continues to inspire generations of inventors and entrepreneurs.

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