The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2017
Filed:
Feb. 19, 2014
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
John J. Garant, Poughkeepsie, NY (US);
Jonathan H. Griffith, Poughkeepsie, NY (US);
Brittany L. Hedrick, Wappingers Falls, NY (US);
Edmund J. Sprogis, Underhill, VT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B32B 37/00 (2006.01); B32B 38/00 (2006.01); H01L 21/683 (2006.01); B32B 37/24 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 37/24 (2013.01); B32B 38/10 (2013.01); B32B 2037/246 (2013.01); B32B 2315/08 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.