The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Apr. 03, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hariklia Deligianni, Alpine, NJ (US);

Devendra K. Sadana, Pleasantville, NY (US);

Edmund J. Sprogis, Myrtle Beach, SC (US);

Naigang Wang, Ossining, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H02M 3/158 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01); H01L 29/778 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 21/288 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 29/66 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H02M 3/158 (2013.01); H01L 21/288 (2013.01); H01L 21/6835 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5226 (2013.01); H01L 23/5227 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/074 (2013.01); H01L 28/10 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01); H01L 2221/6834 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/16165 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10344 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01);
Abstract

Techniques for integrating DC-DC power converters with other on-chip circuitry are provided. In one aspect, an integrated DC-DC power converter includes: a GaN transistor chip having at least one GaN switch formed thereon; an interposer chip, bonded to the GaN transistor chip, having at least one power driver transistor formed thereon; TSVs present in the interposer chip adjacent to the power driver transistor and which connect the power driver transistor to the GaN switch; and an on-chip magnetic inductor formed either on the GaN transistor chip or on the interposer chip. A method of forming a fully integrated DC-DC power converter is also provided.


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