logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10049909 B1

PDFFull Text
Expired
Date of Patent:
Aug. 14, 2018

Filed:

Feb. 14, 2017

Wafer handler and methods of manufacture

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

John J. Garant, Poughkeepsie, NY (US);

Jonathan H. Griffith, Poughkeepsie, NY (US);

Brittany L. Hedrick, Wappingers Falls, NY (US);

Edmund J. Sprogis, Underhill, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:

Anthony Canale

Andrew M. Calderon

Roberts Mlotkowski Safran Cole & Calderon, P.C.

Primary Examiner:

Carson Gross

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 37/24 (2006.01); B32B 38/10 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 37/24 (2013.01); B32B 38/10 (2013.01); B32B 2315/08 (2013.01); B32B 2457/14 (2013.01); B81C 1/00666 (2013.01); B81C 2201/0167 (2013.01); H01L 2221/68304 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A wafer handler with a removable bow compensating layer and methods of manufacture is disclosed. The method includes forming at least one layer of stressed material on a front side of a wafer handler. The method further includes forming another stressed material on a backside of the wafer handler which counter balances the at least one layer of stressed material on the front side of the wafer handler, thereby decreasing an overall bow of the wafer handler.

Find Patent Forward Citations

Garant, John. (2018). Wafer handler and methods of manufacture (U.S. Patent No. 10049909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10049909

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…