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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9748131 B1

PDFFull Text
Date of Patent:
Aug. 29, 2017

Filed:

Nov. 17, 2015

Low temperature adhesive resins for wafer bonding

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Robert D. Allen, San Jose, CA (US);

Paul S. Andry, Yorktown Heights, NY (US);

Jeffrey D. Gelorme, Burlington, CT (US);

Li-wen Hung, Mahopac, NY (US);

John U. Knickerbocker, Yorktown Heights, NY (US);

Cornelia K. Tsang, Mohegan Lake, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Tutunjian & Bitetto, P.C.

Louis J. Percello

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); H01L 21/683 (2006.01); H01L 25/03 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 21/463 (2006.01); H01L 21/306 (2006.01); H01L 21/304 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/30604 (2013.01); H01L 21/463 (2013.01); H01L 21/6835 (2013.01); H01L 21/76256 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/03 (2013.01); H01L 21/304 (2013.01); H01L 21/76898 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

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