IDiyas

For the Inventor, By the Inventor

Stormville, NY, United States of America

David Lee Rath

USPTO Granted Patents = 74 

Average Co-Inventor Count = 4.7

ph-index = 13

Forward Citations = 622(Granted Patents)

DiyaCoin DiyaCoin = 0.36 


Inventors with similar research interests:


Location History:

  • Stromville, NY (US) (1998)
  • Yorktown Heights, NY (US) (2012)
  • Stormville, NY (US) (1991 - 2024)

Company Filing History:

goldMedal73 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal3 out of 14,705 
 
Infineon Technologies Ag
 patents
bronzeMedal2 out of 12,867 
 
Advanced Micro Devices Corporation
 patents
4. 1 out of 1,853 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
where one patent can have more than one assignee

Years Active: 1991-2024

where 'Filed Patents' based on already Granted Patents

74 patents (USPTO):
1. 12048254 - Sacrificial material facilitating protection of a substrate in a qubit device (2024-07-23),
2. 11857997 - Metal surface protection (2024-01-02),
3. 11575077 - Microfabricated air bridges for quantum circuits (2023-02-07),
4. 11316154 - High throughput insulation of 3D in-silicon high volumetric energy and power dense energy storage devices (2022-04-26),
5. 11276767 - Additive core subtractive liner for metal cut etch processes (2022-03-15),
6. 11152489 - Additive core subtractive liner for metal cut etch processes (2021-10-19),
7. 11094873 - Transmon qubits with self defined junctions (2021-08-17),
8. 11075281 - Additive core subtractive liner for metal cut etch processes (2021-07-27),
9. 11024512 - Selective etch formulation for silicon oxide (2021-06-01),
10. 10672707 - Low aspect ratio interconnect (2020-06-02),
11. 10607933 - Interconnect structures with fully aligned vias (2020-03-31),
12. 10600884 - Additive core subtractive liner for metal cut etch processes (2020-03-24),
13. 10242909 - Wet etch removal of Ru selective to other metals (2019-03-26),
14. 10211153 - Low aspect ratio interconnect (2019-02-19),
15. 10204856 - Interconnect structures with fully aligned vias (2019-02-12),

Title: The Innovator Profile: David Lee Rath

Introduction:

David Lee Rath, hailing from Stormville, NY, is a prolific inventor with an impressive portfolio of 74 patents under his belt. His groundbreaking work in the field of qubit devices and metal surface protection has solidified his reputation as a trailblazer in the world of technology.

Latest Patents:

Rath's recent patents showcase his innovative approach to protecting substrates in qubit devices. His invention of sacrificial material for this purpose has opened new avenues in the field. Additionally, his work on metal surface protection, utilizing polymer films for safeguarding metal substrates during lithography processes, demonstrates his versatility and ingenuity.

Career Highlights:

With a career marked by excellence, David Lee Rath has left an indelible mark on some prestigious companies. He has made significant contributions during his tenure at International Business Machines Corporation (IBM) and Infineon Technologies Ag, where his expertise and inventive spirit have been instrumental in driving technological advancement.

Collaborations:

In his journey of innovation, Rath has collaborated with esteemed colleagues such as Elbert Emin Huang and Rangarajan Jagannathan. Together, they have worked on pioneering projects, pushing the boundaries of what is achievable in the realm of technology.

Conclusion:

David Lee Rath's unwavering dedication to innovation, coupled with his exceptional problem-solving skills, has established him as a luminary in the field of inventions. His remarkable patents and successful collaborations serve as a testament to his commitment to shaping the future of technology.

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