The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2019

Filed:

Nov. 09, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Benjamin D. Briggs, Waterford, NY (US);

Cornelius B. Peethala, Albany, NY (US);

David L. Rath, Stormville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76883 (2013.01); H01L 21/32134 (2013.01); H01L 21/76802 (2013.01); H01L 21/76804 (2013.01); H01L 21/76846 (2013.01); H01L 21/76847 (2013.01); H01L 21/76853 (2013.01); H01L 21/76861 (2013.01); H01L 21/76865 (2013.01); H01L 21/76871 (2013.01); H01L 21/76892 (2013.01); H01L 23/53238 (2013.01);
Abstract

A method for forming a conductive structure for a semiconductor device includes depositing a barrier layer in a trench formed in a dielectric material and forming an interface layer over the barrier layer. A main conductor is formed over the interface layer, and the main conductor is recessed selectively to the interface layer and the barrier layer to a position below a top surface of the dielectric layer. The interface layer is selectively wet etched to the main conductor and the barrier layer using a chemical composition having an oxidizer, wherein the chemical composition is buffered to include a pH above 7. The barrier layer is selectively etching to the main conductor and the interface layer.


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