The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 03, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John Collins, Tarrytown, NY (US);

John M. Papalia, New York, NY (US);

David L. Rath, Stormville, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 4/134 (2010.01); H01M 4/1395 (2010.01); H01M 4/133 (2010.01); H01M 4/1393 (2010.01); H01M 4/38 (2006.01); H01M 10/0525 (2010.01); H01M 10/058 (2010.01);
U.S. Cl.
CPC ...
H01M 4/386 (2013.01); H01M 4/134 (2013.01); H01M 4/1395 (2013.01); H01M 4/382 (2013.01); H01M 10/058 (2013.01); H01M 10/0525 (2013.01);
Abstract

A three dimensional (3D) In-Silicon energy storage device is provided by a method that includes forming a thick dielectric material layer on a surface of a silicon based substrate. A 3D trench is then formed into the dielectric material layer and the silicon based substrate, and thereafter a dielectric material spacer is formed, in addition to the dielectric remaining on the field of the substrate, as well as along a sidewall of the 3D trench, and on a first portion of a sub-surface of the silicon based substrate that is present at a bottom of the 3D trench. A second portion of the sub-surface of the silicon based substrate that is present in the 3D trench remains physically exposed. Active energy storage device materials can then be formed laterally adjacent to the dielectric material spacer that is within the 3D trench and on the dielectric material layer.


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