This inventor holds 188 USPTO granted patents and 16 published patent applications, plus 1 CIPO patent and 1 EPO patent, primarily in 3D Integration Technology (CPC class H01L2-348). Top assignees: International Business Machines Corporation, Advanced Micro Devices Corporation, Globalfoundries Inc.. Active years: 1991-2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
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Location History:
- Yorktown Heights, NC (US) (2013)
- Armonk, NY (US) (2012 - 2020)
- Yorktown Heights, NY (US) (1991 - 2021)
Company Filing History:
184 out of 166,325 
2 out of 13,161 
2 out of 5,671 
Years Active: 1991-2021
Areas of Expertise:
Title: Sampath Purushothaman: Pioneering Innovator with 188 Patents
Introduction:
Sampath Purushothaman, a visionary inventor based in Yorktown Heights, NY, has made significant contributions to the field of materials science and 3D integration. With an impressive track record of 188 patents, Purushothaman has consistently pushed the boundaries of technological advancements. His groundbreaking inventions and innovative processes have revolutionized various industries, particularly in the realm of adhesive materials and 3D applications.
Latest Patents:
One of Purushothaman's recent patents showcases his expertise in developing enhanced adhesive materials for 3D applications. His invention involves a composite system filled with carbon nanotubes (CNT) and polymer, possessing impressive thermal conductivity and high-temperature stability. This composite material is designed specifically for use in 3D and 4D integration, particularly for joining device sub-laminate layers. Additionally, by achieving a coefficient of thermal expansion (CTE) similar to silicon (Si), Purushothaman enables reduced wafer structural warping during high-temperature processing cycles.
Another notable patent by Purushothaman centers around a 3D integration method that utilizes silicon-on-insulator (SOI) substrates. This process includes the formation of through vias to connect layers within silicon wafers. The aim is to establish efficient electrical pathways while incorporating appropriate insulation to isolate the through vias from the SOI device layer. The resultant article of manufacture produced through this method opens up new avenues for improved device integration and performance.
Career Highlights:
Throughout his career, Sampath Purushothaman has worked with prestigious organizations at the forefront of technological advancements. Notable among these is his association with IBM (International Business Machines Corporation), where he played an instrumental role in driving innovation and patent development. Purushothaman's employment at IBM Corporation further underscores his commitment to advancing research in the materials science field.
Collaborations:
Purushothaman's dedication to collaboration and knowledge-sharing is evident in his collaborations with talented peers within the industry. Some of his notable coworkers include Satyanarayana Venkata Nitta and Matthew Earl Colburn. These collaborations have been vital in accelerating breakthroughs and fostering innovation in adhesive materials, 3D integration, and related fields.
Conclusion:
Sampath Purushothaman's extensive patent portfolio and remarkable contributions to the field of materials science and 3D integration demonstrate his unwavering commitment to innovation. With his latest patents focusing on advanced adhesive materials and 3D integration methods, Purushothaman continues to shape the future of technology. His collaborations and association with prestigious companies like IBM further attest to his expertise and dedication. As an inventor and researcher, Purushothaman continues to inspire and lead the way towards transformative advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile