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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9994741 B1

PDFFull Text
Date of Patent:
Jun. 12, 2018

Filed:

Dec. 13, 2015

Enhanced adhesive materials and processes for 3d applications

Applicants:

James L. Hedrick, San Jose, CA (US);

Robert Dennis Miller, San Jose, CA (US);

Deborah Ann Neumayer, Yorktown Heights, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Mary E. Rothwell, Yorktown Heights, NY (US);

Willi Volksen, San Jose, CA (US);

Roy R. Yu, Yorktown Heights, NY (US);

Inventors:

James L. Hedrick, San Jose, CA (US);

Robert Dennis Miller, San Jose, CA (US);

Deborah Ann Neumayer, Yorktown Heights, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Mary E. Rothwell, Yorktown Heights, NY (US);

Willi Volksen, San Jose, CA (US);

Roy R. Yu, Yorktown Heights, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Thomas A. Beck

Daniel P. Morris

Primary Examiner:

Tae H Yoon

Int. Cl.
CPC ...
C08K 3/04 (2006.01); C09J 9/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 179/08 (2006.01); C09J 179/04 (2006.01); C09J 183/04 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C08K 7/24 (2006.01); C08K 5/5425 (2006.01); C08K 5/5465 (2006.01); C08K 5/548 (2006.01); C08K 5/544 (2006.01);
U.S. Cl.
CPC ...
C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 179/04 (2013.01); C09J 179/08 (2013.01); C09J 183/04 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C08K 5/544 (2013.01); C08K 5/548 (2013.01); C08K 5/5425 (2013.01); C08K 5/5465 (2013.01); C08K 7/24 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83895 (2013.01); H01L 2225/06544 (2013.01); Y10S 977/742 (2013.01); Y10S 977/833 (2013.01); Y10S 977/843 (2013.01);
Abstract

The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

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