The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8963278 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 24, 2015

Filed:

Nov. 22, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Douglas C. La Tulipe, Jr., Guilderland, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

James Vichiconti, Peekskill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/06 (2013.01); H01L 21/02002 (2013.01); H01L 21/6835 (2013.01); H01L 21/76251 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/83121 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01033 (2013.01);
Abstract

A donor wafer containing integrated semiconductor device. The donor wafer has a donor wafer membrane portion that has a device layer and a buried insulating layer. The donor wafer membrane portion has a number of integrated semiconductor devices where each integrated semiconductor device within the plurality of semiconductor devices corresponds to a die formed on the donor wafer. The donor wafer membrane portion has a diameter of at least 200 mm. The donor wafer has a crystalline substrate that is substantially removed from an area of the donor wafer membrane portion such that the device layer and the buried insulating layer of the donor wafer membrane in the area is configured to conform to a pattern specific topology on an acceptor surface. The donor wafer further has a support structure attached to regions of the donor wafer that are outside of the donor wafer membrane portion.


Find Patent Forward Citations

Loading…