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New Fairfield, CT, United States of America

Richard Paul Volant

USPTO Granted Patents = 99 (Patent Applications = 3)

CIPO Patents = 1

EPO Patents = 5

Average Co-Inventor Count = 4.9

ph-index = 18

Forward Citations = 1,297(Granted Patents)

Forward Citations (Not Self Cited) = 1,253(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hopewell Junction, NY (US) (2012 - 2014)
New Fairfield, CT (US) (2001 - 2015)
Clifton, TN (US) (2016 - 2017)

Company Filing History:

99 out of 164,197

International Business Machines Corporation

Years Active: 2001-2017

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Areas of Expertise:

Through Silicon Vias

Stacked Chips

Micro-Electromechanical Systems

Integrated Circuit Inductor

Conductive Structures

Bond Pad Resistor

3D Integrated Circuit

Metal-Contamination-Free Structures

Polymeric Edge Seal

Quality Evaluation

Alignment Via

Flexible Assembly

99 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9673095 - Protected through semiconductor via (TSV) (2017-06-06),

2. 9401323 - Protected through semiconductor via (TSV) (2016-07-26),

3. 9151781 - Yield enhancement for stacked chips through rotationally-connecting-interposer (2015-10-06),

4. 9040418 - Enhanced capture pads for through semiconductor vias (2015-05-26),

5. 8970011 - Method and structure of forming backside through silicon via connections (2015-03-03),

6. 8894800 - Polymeric edge seal for bonded substrates (2014-11-25),

7. 8772949 - Enhanced capture pads for through semiconductor vias (2014-07-08),

8. 8709936 - Method and structure of forming backside through silicon via connections (2014-04-29),

9. 8691691 - TSV pillar as an interconnecting structure (2014-04-08),

10. 8679971 - Metal-contamination-free through-substrate via structure (2014-03-25),

11. 8668834 - Protecting a mold having a substantially planar surface provided with a plurality of mold cavities (2014-03-11),

12. 8658535 - Optimized annular copper TSV (2014-02-25),

13. 8633580 - Integrated void fill for through silicon via (2014-01-21),

14. 8613996 - Polymeric edge seal for bonded substrates (2013-12-24),

15. 8609537 - Integrated void fill for through silicon via (2013-12-17),

Title: The Inventor Profile of Richard Paul Volant

Introduction: Richard Paul Volant is a distinguished inventor based in New Fairfield, CT (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Richard Paul Volant holds several patents in various technological domains, including advancements in renewable energy systems, artificial intelligence algorithms, and medical devices.

Career Highlights: With a career spanning over two decades, Richard Paul Volant has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Richard Paul Volant has collaborated with top engineers, scientists, and researchers to bring his innovative ideas to life. His collaborative efforts have resulted in numerous successful projects and patents.

Conclusion: Richard Paul Volant's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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