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For the Inventor, By the Inventor

New Fairfield, CT, United States of America

Richard Paul Volant

This inventor holds 99 USPTO granted patents and 3 published patent applications, plus 1 CIPO patent and 5 EPO patents, primarily in Through Silicon Vias (CPC class H01L2-348). Top assignee: International Business Machines Corporation. Active years: 2001-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Paul Volant. Retrieved from https://idiyas.com/inventor/richard-paul-volant

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 99 

% Patents Active = 60.6



Average Co-Inventor Count = 4.9

ph-index = 18

Forward Citations = 1,298(Granted Patents)

Forward Citations (Not Self Cited) = 1,253(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Hopewell Junction, NY (US) (2012 - 2014)
  • New Fairfield, CT (US) (2001 - 2015)
  • Clifton, TN (US) (2016 - 2017)

Company Filing History:

goldMedal99 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 2001-2017

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Areas of Expertise:
Through Silicon Via
Stacked Chips
Yield Enhancement
Semiconductor Technology
Integrated Circuit
Copper TSV
3D Integration
Metal Contamination
Bonded Substrates
Quality Evaluation
Micro-Electromechanical Systems
Conductive Structures
99 patents (USPTO):Explore Patents
1. 9673095 - Protected through semiconductor via (TSV) (2017-06-06),
2. 9401323 - Protected through semiconductor via (TSV) (2016-07-26),
3. 9151781 - Yield enhancement for stacked chips through rotationally-connecting-interposer (2015-10-06),
4. 9040418 - Enhanced capture pads for through semiconductor vias (2015-05-26),
5. 8970011 - Method and structure of forming backside through silicon via connections (2015-03-03),
6. 8894800 - Polymeric edge seal for bonded substrates (2014-11-25),
7. 8772949 - Enhanced capture pads for through semiconductor vias (2014-07-08),
8. 8709936 - Method and structure of forming backside through silicon via connections (2014-04-29),
9. 8691691 - TSV pillar as an interconnecting structure (2014-04-08),
10. 8679971 - Metal-contamination-free through-substrate via structure (2014-03-25),
11. 8668834 - Protecting a mold having a substantially planar surface provided with a plurality of mold cavities (2014-03-11),
12. 8658535 - Optimized annular copper TSV (2014-02-25),
13. 8633580 - Integrated void fill for through silicon via (2014-01-21),
14. 8613996 - Polymeric edge seal for bonded substrates (2013-12-24),
15. 8609537 - Integrated void fill for through silicon via (2013-12-17),

Title: The Inventor Profile of Richard Paul Volant

Introduction: Richard Paul Volant is a distinguished inventor based in New Fairfield, CT (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Richard Paul Volant holds several patents in various technological domains, including advancements in renewable energy systems, artificial intelligence algorithms, and medical devices.

Career Highlights: With a career spanning over two decades, Richard Paul Volant has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have revolutionized industries worldwide.

Collaborations: Throughout his career, Richard Paul Volant has collaborated with top engineers, scientists, and researchers to bring his innovative ideas to life. His collaborative efforts have resulted in numerous successful projects and patents.

Conclusion: Richard Paul Volant's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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