The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Jul. 29, 2011
Mukta G. Farooq, Hopewell Junction, NY (US);
Troy L. Graves-abe, Wappingers Falls, NY (US);
William F. Landers, Wappingers Falls, NY (US);
Kevin S. Petrarca, Newburgh, NY (US);
Richard P. Volant, New Fairfield, CT (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
Troy L. Graves-Abe, Wappingers Falls, NY (US);
William F. Landers, Wappingers Falls, NY (US);
Kevin S. Petrarca, Newburgh, NY (US);
Richard P. Volant, New Fairfield, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention includes embodiments of a processing method, and resulting structure, for building a chip having a TSV pillar which can be used as an interconnecting structure. The process includes the deposition of a dual diffusion barrier between the TSV and the substrate the TSV is embedded within. The TSV is then exposed from the back side of the substrate so that at least a portion of the TSV protrudes from the substrate and can be used as a contact for connecting the chip to another surface. The resulting TSV is rigid, highly conductive, can be placed in a tightly pitched grid of contacts, and reduces effects of CTE mismatch.