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Wappingers Falls, NY, United States of America

Troy Lawrence Graves-Abe

This inventor holds 27 USPTO granted patents and 4 published patent applications, primarily in 3D Integrated Circuits. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2012-2020.

USPTO Granted Patents = 27 (Patent Applications = 4)

% Patents Active = 40.7

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 67(Granted Patents)

Location History:

Hopewell Junction, NY (US) (2015)
Wappinger Falls, NY (US) (2014 - 2016)
Wappingers Falls, NY (US) (2012 - 2020)

Company Filing History:

20 out of 166,325

International Business Machines Corporation

Years Active: 2012-2020

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Areas of Expertise:

Through-Silicon Via

3D Integration

Wafer Bonding

Electrical Leakage

Copper Interconnects

Multi-Stage Vias

Silicon Etch

TSV Structures

Interconnecting Structure

Dielectric Line

Plating Techniques

Circuit Integration

27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10613754 - Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration (2020-04-07),

2. 10503402 - Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration (2019-12-10),

3. 10296698 - Forming multi-sized through-silicon-via (TSV) structures (2019-05-21),

4. 10170337 - Implant after through-silicon via (TSV) etch to getter mobile ions (2019-01-01),

5. 9886193 - Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration (2018-02-06),

6. 9640514 - Wafer bonding using boron and nitrogen based bonding stack (2017-05-02),

7. 9476927 - Structure and method to determine through silicon via build integrity (2016-10-25),

8. 9263324 - 3-D integration using multi stage vias (2016-02-16),

9. 9257336 - Bottom-up plating of through-substrate vias (2016-02-09),

10. 9252133 - Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures (2016-02-02),

11. 9214435 - Via structure for three-dimensional circuit integration (2015-12-15),

12. 9060457 - Sidewalls of electroplated copper interconnects (2015-06-16),

13. 9055703 - Sidewalls of electroplated copper interconnects (2015-06-09),

14. 9040407 - Sidewalls of electroplated copper interconnects (2015-05-26),

15. 8975910 - Through-silicon-via with sacrificial dielectric line (2015-03-10),

Title: Innovations of Troy Lawrence Graves-Abe

Introduction

Troy Lawrence Graves-Abe, based in Wappingers Falls, NY, is a prolific inventor recognized for his significant contributions to technology. With an impressive portfolio of 27 patents, Graves-Abe has made substantial advancements particularly in the field of processor-memory systems.

Latest Patents

Among his latest innovations are the patents covering the architecture and implementation of cortical systems, as well as techniques for fabricating architecture using 3D wafer scale integration. Notable disclosures include a processor-memory system, a stacked-wafer processor-memory system, and advanced methods for their fabrication. This system comprises a memory area and a multitude of specialized processors that are embedded within the memory region. Each specialized processor is designed to execute specific operations utilizing a corresponding memory domain. Additionally, a management processor is incorporated to oversee the operations of these specialized processors. The architecture also introduces a specialized processor wafer that integrates the memory area and the embedded processors.

Career Highlights

Graves-Abe has garnered valuable experience through his work at prominent companies such as IBM and Globalfoundries Inc. His tenure at these leading technology firms has provided him with the platform to develop and refine his groundbreaking inventions.

Collaborations

Throughout his career, Graves-Abe has collaborated with talented professionals, including Mukta G. Farooq and John Anthony Fitzsimmons. These collaborations have played a crucial role in his innovative journey and the successful development of his patents.

Conclusion

Troy Lawrence Graves-Abe exemplifies the spirit of innovation with his extensive work in processor-memory systems. His contributions continue to influence advancements in the field, making him a notable figure in the realm of modern technology. His dedication to research and development underscores the imperative role inventors play in shaping the future.

Profile summary based on public USPTO records.

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