The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Dec. 14, 2016
Globalfoundries Inc., Grand Cayman, KY;
Mukta G. Farooq, Hopewell Junction, NY (US);
Troy L. Graves-Abe, Wappingers Falls, NY (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
Various embodiments include approaches for designing through-silicon vias (TSVs) in integrated circuits (ICs). In some cases, a method includes: identifying types of through-silicon vias (TSVs) for placement within an integrated circuit (IC) design based upon an electrical requirement for the TSVs, wherein the IC design includes distinct types of TSVs; calculating etch and fill rates for the IC design with the distinct types of TSVs with common etching and filling processes; and providing fabrication instructions to form the distinct types of TSVs according to the calculated etch and fill rates in the common processes.