The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9060457 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 16, 2015

Filed:

Oct. 01, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

Troy L. Graves-Abe, Wappingers Falls, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H05K 3/423 (2013.01); Y10T 428/12764 (2015.01); H01L 23/481 (2013.01); H01L 23/53238 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01); H01L 21/76898 (2013.01); H01L 21/76844 (2013.01); H01L 21/76846 (2013.01); H01L 21/76858 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A structure including a first intermetallic compound and an alloy layer parallel to a sidewall of an opening and separating a diffusion barrier from a conductive material, the diffusion barrier is in direct contact with the alloy layer, the alloy layer is in direct contact with the first intermetallic compound, the first intermetallic compound is in direct contact with the conductive material, the first intermetallic compound is a precipitate within a solid solution of an alloying material of the alloy layer and the conductive material, and is molecularly bound to both the alloy layer and the conductive material, the alloy layer excludes the conductive material, and a first high friction interface located between the diffusion barrier and the alloy layer extending in a direction parallel to the sidewall of the opening, the first high friction interface results in a mechanical bond between the diffusion barrier and the alloy layer.


Find Patent Forward Citations

Loading…