Enter inventor name

Wappingers Falls, NY, United States of America

William Francis Landers

This inventor holds 33 USPTO granted patents and 6 published patent applications and 1 EPO patent. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1997-2024.

USPTO Granted Patents = 33 (Patent Applications = 6)

% Patents Active = 69.7

EPO Patents = 1

Average Co-Inventor Count = 4.3

ph-index = 9

Forward Citations = 343(Granted Patents)

Location History:

Beacon, NY (US) (1997)
Hopewell Junction, NY (US) (2014)
Wappingers Falls, NY (US) (1999 - 2022)

Company Filing History:

32 out of 166,264

International Business Machines Corporation

Years Active: 1997-2024

Loading Chart...

Areas of Expertise:

Embedded Microstrip Transmission Line

Microfluidic Chips

3D Integrated Circuits

TSV Pillar

Circuit Design Checking

Electromigration Resistance

Copper-to-C4 Connection

Low-k Dielectrics

Chemical Mechanical Polishing

Surface Topography Imaging

Vertical Polishing Tool

Interconnection Structures

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12166260 - Embedded microstrip transmission line (2024-12-10),

2. 11469485 - Embedded microstrip transmission line (2022-10-11),

3. 11458474 - Microfluidic chips with one or more vias (2022-10-04),

4. 9490197 - Three dimensional organic or glass interposer (2016-11-08),

5. 9059167 - Structure and method for making crack stop for 3D integrated circuits (2015-06-16),

6. 8859390 - Structure and method for making crack stop for 3D integrated circuits (2014-10-14),

7. 8691691 - TSV pillar as an interconnecting structure (2014-04-08),

8. 8546961 - Alignment marks to enable 3D integration (2013-10-01),

9. 8386977 - Circuit design checking for three dimensional chip technology (2013-02-26),

10. 8367543 - Structure and method to improve current-carrying capabilities of C4 joints (2013-02-05),

11. 8288270 - Enhanced electromigration resistance in TSV structure and design (2012-10-16),

12. 8237288 - Enhanced electromigration resistance in TSV structure and design (2012-08-07),

13. 7863183 - Method for fabricating last level copper-to-C4 connection with interfacial cap structure (2011-01-04),

14. 7714452 - Structure and method for producing multiple size interconnections (2010-05-11),

15. 7678673 - Strengthening of a structure by infiltration (2010-03-16),

Title: William Francis Landers: Pioneering Inventor from Wappingers Falls

Introduction: William Francis Landers is a renowned inventor hailing from Wappingers Falls, NY. His innovative spirit and dedication to technological advancements have made him a prominent figure in the world of patents and inventions.

Latest Patents: Landers holds several patents in various fields, including renewable energy, medical devices, and consumer electronics. His recent patents focus on sustainable energy solutions and cutting-edge healthcare technologies.

Career Highlights: Throughout his illustrious career, Landers has worked with leading research institutions and companies to bring his inventions to life. His contributions have significantly impacted the fields of clean energy and healthcare, earning him recognition as a visionary inventor.

Collaborations: Landers has collaborated with top universities and research institutions to further his research and development efforts. His partnerships with industry experts and fellow inventors have led to groundbreaking innovations that continue to shape the future of technology.

Conclusion: William Francis Landers' passion for innovation and commitment to pushing the boundaries of what is possible have solidified his legacy as a pioneering inventor. His contributions to various industries have not only improved the quality of life for many but have also inspired the next generation of inventors to dream big and think outside the box.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to [email protected]