The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2010
Filed:
Aug. 30, 2007
Lawrence A. Clevenger, LaGrangeville, NY (US);
Mukta Ghate Farooq, Hopewell Junction, NY (US);
Louis Lu-chen Hsu, Fishkill, NY (US);
William Francis Landers, Wappingers Falls, NY (US);
Donna S. Zupanski-nielson, Yorktown Heights, NY (US);
Carl John Radens, LaGrangeville, NY (US);
Chih-chao Yang, Poughkeepsie, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Mukta Ghate Farooq, Hopewell Junction, NY (US);
Louis Lu-Chen Hsu, Fishkill, NY (US);
William Francis Landers, Wappingers Falls, NY (US);
Donna S. Zupanski-Nielson, Yorktown Heights, NY (US);
Carl John Radens, LaGrangeville, NY (US);
Chih-Chao Yang, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.