The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2016

Filed:

Nov. 14, 2014
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta G. Farooq, Hopewell Junction, NY (US);

William F. Landers, Wappingers Falls, NY (US);

Jin Liu, Chappaqua, NY (US);

Andrew J. Martin, Carmel, NY (US);

Kathryn E. Schlichting, Pleasant Valley, NY (US);

Melissa A. Smith, Wappingers Falls, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H05K 1/0306 (2013.01); H05K 1/0313 (2013.01); H05K 3/007 (2013.01); H05K 3/0017 (2013.01); H05K 3/423 (2013.01); H05K 2203/0733 (2013.01); H05K 2203/143 (2013.01); H05K 2203/1461 (2013.01);
Abstract

A three-dimensional organic structure or glass interposer structure and methods of manufacture are disclosed. The method includes forming lined metal vias in a substrate. The method further includes removing the substrate, leaving the lined metal vias. The method further includes forming a new substrate about the lined metal vias. The method also includes connecting the lined metal vias to wiring layers using back end of the line processes.


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