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Ballston Lake, NY, United States of America

Jin Ping Liu

USPTO Granted Patents = 48 (Patent Applications = 9)

Average Co-Inventor Count = 3.2

ph-index = 10

Forward Citations = 705(Granted Patents)

Location History:

Singapore, SG (2006 - 2014)
Beacon, NY (US) (2011 - 2014)
Hopewell Junction, NY (US) (2015 - 2016)
Malta, NY (US) (2017)
Chappaqua, NY (US) (2013 - 2019)
Ballston Lake, NY (US) (2015 - 2019)

Company Filing History:

33 out of 5,671

Globalfoundries Inc.

9 out of 164,197

International Business Machines Corporation

Chartered Semiconductor Manufacturing Ltd (corporation)

4. 4 out of 1,020

Globalfoundries Singapore Pte. Ltd.

where one patent can have more than one assignee

Years Active: 2006-2019

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Areas of Expertise:

Transistor Structures

Integrated Circuits

FinFET Devices

High-K Dielectric Layer

Epitaxial Growth

Voltage Contrast Inspection

Non-bridging Contact

Silicon-Germanium Substrate

Defect-Free Semiconductor Structures

Gate-All-Around Transistors

Deep Trench Isolation

Strained Channel Transistor

48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10217696 - Non-bridging contact via structures in proximity (2019-02-26),

2. 10204991 - Transistor structures and fabrication methods thereof (2019-02-12),

3. 9941191 - Non-bridging contact via structures in proximity (2018-04-10),

4. 9698269 - Conformal nitridation of one or more fin-type transistor layers (2017-07-04),

5. 9673039 - Devices comprising high-K dielectric layer and methods of forming same (2017-06-06),

6. 9647073 - Transistor structures and fabrication methods thereof (2017-05-09),

7. 9620380 - Methods for fabricating integrated circuits using self-aligned quadruple patterning (2017-04-11),

8. 9595493 - Reducing liner corrosion during metallization of semiconductor devices (2017-03-14),

9. 9490197 - Three dimensional organic or glass interposer (2016-11-08),

10. 9472465 - Methods of fabricating integrated circuits (2016-10-18),

11. 9466723 - Liner and cap layer for placeholder source/drain contact structure planarization and replacement (2016-10-11),

12. 9455201 - Integration method for fabrication of metal gate based multiple threshold voltage devices and circuits (2016-09-27),

13. 9443956 - Method for forming air gap structure using carbon-containing spacer (2016-09-13),

14. 9419126 - Integrated circuits and methods for fabricating integrated circuits with active area protection (2016-08-16),

15. 9406676 - Method for forming single diffusion breaks between finFET devices and the resulting devices (2016-08-02),

Title: Inventor Jin Ping Liu

Introduction: Jin Ping Liu is a renowned inventor based in Ballston Lake, NY. He is known for his innovative contributions in various fields.

Latest Patents: Jin Ping Liu holds several patents in the areas of technology and engineering, showcasing his continuous commitment to innovation.

Career Highlights: Throughout his career, Jin Ping Liu has demonstrated a strong passion for creating groundbreaking solutions. His work has significantly impacted the industry and inspired many aspiring inventors.

Collaborations: Jin Ping Liu has collaborated with leading companies and research institutions to further develop his inventions. His ability to work in diverse teams has led to the successful implementation of his ideas.

Conclusion: Jin Ping Liu's dedication to innovation and his remarkable achievements make him a prominent figure in the world of inventors. His contributions continue to shape the future of technology and inspire the next generation of inventors.

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