The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 11, 2016

Filed:

Jun. 26, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Haigou Huang, Rexford, NY (US);

Qiang Fang, Ballston Lake, NY (US);

Jin Ping Liu, Ballston Lake, NY (US);

Huang Liu, Mechanicville, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 21/283 (2006.01); H01L 29/66 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); H01L 23/535 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7851 (2013.01); H01L 21/0217 (2013.01); H01L 21/02126 (2013.01); H01L 21/31053 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 23/535 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01);
Abstract

A method includes forming a placeholder source/drain contact structure above a semiconductor material. A conformal deposition process is performed to form a liner layer above the placeholder contact structure. A dielectric layer is formed above the liner layer. A first planarization process is performed to remove material of the dielectric layer and expose a first top surface of the liner layer above the placeholder contact structure. A first cap layer is formed above the dielectric layer. A second planarization process is performed to remove material of the first cap layer and the liner layer to expose a second top surface of the placeholder contact structure. The placeholder contact structure is removed to define a source/drain contact recess in the dielectric layer. The sidewalls of the dielectric layer in the source/drain contact recess are covered by the liner layer. A conductive material is formed in the contact recess.


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