The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2014

Filed:

Feb. 05, 2010
Applicants:

Mukta G Farooq, Hopewell Junction, NY (US);

John a Griesemer, Hopewell Junction, NY (US);

William F Landers, Hopewell Junction, NY (US);

Ian D Melville, Hopewell Junction, NY (US);

Thomas M Shaw, Yorktown Heights, NY (US);

Huilong Zhu, Poughkeepsie, NY (US);

Inventors:

Mukta G Farooq, Hopewell Junction, NY (US);

John A Griesemer, Hopewell Junction, NY (US);

William F Landers, Hopewell Junction, NY (US);

Ian D Melville, Hopewell Junction, NY (US);

Thomas M Shaw, Yorktown Heights, NY (US);

Huilong Zhu, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 25/065 (2006.01); H01L 21/78 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2924/0002 (2013.01); H01L 2225/06541 (2013.01); H01L 25/0657 (2013.01); H01L 23/3114 (2013.01); H01L 21/78 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 2924/12044 (2013.01); H01L 21/2007 (2013.01); H01L 21/76898 (2013.01);
Abstract

A structure to prevent propagation of a crack into the active region of a 3D integrated circuit, such as a crack initiated by a flaw at the periphery of a thinned substrate layer or a bonding layer, and methods of forming the same is disclosed.


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