The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Jul. 31, 2014
International Business Machines Corporation, Armonk, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
John A. Griesemer, Salt Point, NY (US);
William F. Landers, Wappingers Falls, NY (US);
Ian D. Melville, Highland, NY (US);
Thomas M. Shaw, Peekskill, NY (US);
Huilong Zhu, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention relates to bonded semiconductor integrated circuits, more specifically to a structure to protect against crack propagation into any layer of such integrated circuits. Embodiments of the present invention may include a first semiconductor substrate having a first layer bonded to second layer of a substantially thinner second semiconductor substrate by a bonding layer. The first layer may contain a crack stop. The crack stop may be in contact with a circumferential wall, made up of posts, that extends through the bonding layer, the second layer, and the second substrate.